PCB Products & Manufacturing Capabilities
Explore our comprehensive PCB manufacturing and assembly capabilities, from bare boards to fully integrated electronic systems.
Our Integrated Services
We provide end-to-end PCB and electronics manufacturing services with a focus on quality, efficiency, and reliability.
- Rigid PCB
- HDI PCB
Printed Circuit Boards
High-quality PCB fabrication from standard FR-4 boards to advanced high-frequency and HDI designs. Supporting multi-layer structures, impedance control, and specialized materials for demanding applications.
- Component Procurement
- Custom Display
PCB Assembly
Comprehensive PCB assembly services including SMT, THT, and mixed technology, supporting prototypes to mass production with strict quality control.
- DFM / DFA
- Stack-up design
PCB Design-Aid & Layout
Professional engineering support for PCB design optimization, ensuring manufacturability, signal integrity, and cost efficiency.
- Side plating
- Via-in-pad
Drilling & Through-Hole Plating
Precision drilling and plating technologies enabling reliable electrical connections across multilayer boards, including microvias and blind/buried vias.
- AOI
- X-ray
Quality Assurance
Advanced inspection systems ensure every PCB and PCBA meets strict quality standards and industry certifications.
- FR-4
- High-Tg
Layer Buildup
Flexible stack-up configurations and advanced materials selection to meet performance, thermal, and high-frequency requirements.
Advanced PCB & Electronics Manufacturing Capabilities
- PCB Fabrication
- PCB Assembly
- Parts Management
- Functional Testing
- IC Programming
- Full Product Assembly
YSX offers One-Stop Solution for PCB & Prototype Assembly and specializes in PCB Prototype and small run services. providing high-tech low-cost PCB / multilayer boards with up to 14 layers. For example Impedance Control PCB, Buried & Blind Holes PCB, and multilayer-layer PCBs. Our capabilities include:
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PCBs with up to 14 layers
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Min track/spacing 0.1mm/4mil
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High-Temp,FR4,Flex,HDI,Rogers,etc
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Laser Direct Imaging (LDI)
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Blind,Buried and Plugged Vias
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Special colors & -lacquer
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100% Electrical Testing
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Special materials, finishes, and edge plating
PCB Assembly
We provide high-precision PCB assembly services covering SMT, THT, and mixed technology for prototypes, small batches, and mass production. With advanced placement equipment and strict process control, we ensure consistent soldering quality and reliable electrical performance.
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SMT, THT, and mixed technology assembly
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Support for 01005 components, BGA, QFN, and fine-pitch devices
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Double-sided and high-density assembly
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High-speed automated pick-and-place systems
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Reflow and wave soldering processes
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AOI and X-ray inspection for quality assurance
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RoHS-compliant assembly processes
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Prototype to mass production support
Parts Management
We offer comprehensive component sourcing and management services to ensure stable supply, cost efficiency, and high-quality materials for every production project. Our global supply chain network helps reduce lead time and minimize procurement risks.
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Global component sourcing from authorized distributors
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BOM optimization and cost reduction support
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Incoming material inspection and verification
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Inventory management and material tracking
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Obsolescence and alternative part substitution
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Supply chain risk control and shortage management
Functional Testing
We provide comprehensive functional testing services to ensure every assembled product meets performance and reliability requirements. Customized test solutions are developed based on product specifications and application scenarios.
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100% testing for critical applications
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100% Electrical Testing
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Automated testing system integration
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Quality verification before shipment
IC Programming
We provide efficient and accurate IC programming services for a wide range of semiconductor devices, ensuring correct firmware loading and traceability throughout the production process.
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In-system and standalone IC programming
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Support for MCU, EEPROM, Flash, and CPLD devices
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Batch programming for high-volume production
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Firmware loading and verification
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Unique serial number and data programming
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Programming traceability and logging system
Full Product Assembly
We provide complete product assembly services from PCB integration to final system build. Our capabilities cover mechanical assembly, wiring, enclosure installation, and final product testing to deliver fully finished electronic products.
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Complete box build and system integration
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Mechanical assembly and enclosure installation
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Cable harness and wiring assembly
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Sub-system integration and module assembly
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Final product functional testing
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Burn-in and aging tests for reliability
Your Trusted PCB Assembly Partner
Whether you're validating a new design or preparing for production, our PCBA service helps you move forward with confidence.
PCB Technology Comparison
From basic FR-4 boards to high-frequency and HDI designs, our technology comparison covers the full spectrum. Review the trade-offs between cost-effectiveness and signal integrity to make an informed decision.
| Core Positioning | Meets basic electrical connection requirements, prioritizing cost-effectiveness. | Handles high-speed/high-frequency signals, prioritizing high performance and high reliability. |
| Substrate Material | Standard FR-4 Epoxy Glass | High-frequency materials (e.g., Rogers series), PTFE, Ceramic substrates, Metal substrates |
| Line Width/Space | ≥ 0.1mm (Relatively loose) | ≤ 0.075mm, or even micron-level (e.g., HDI boards) |
| Interconnect Tech | Simple through-hole | High-Density Interconnect (HDI), Stacked Microvias |
| Core Positioning | Meets basic electrical connection requirements, prioritizing cost-effectiveness. | Handles high-speed/high-frequency signals, prioritizing high performance and high reliability. |
| Substrate Material | Standard FR-4 Epoxy Glass | High-frequency materials (e.g., Rogers series), PTFE, Ceramic substrates, Metal substrates |
| Line Width/Space | ≥ 0.1mm (Relatively loose) | ≤ 0.075mm, or even micron-level (e.g., HDI boards) |
| Interconnect Tech | Simple through-hole | High-Density Interconnect (HDI), Stacked Microvias |
| Core Positioning | Meets basic electrical connection requirements, prioritizing cost-effectiveness. | Handles high-speed/high-frequency signals, prioritizing high performance and high reliability. |
| Substrate Material | Standard FR-4 Epoxy Glass | High-frequency materials (e.g., Rogers series), PTFE, Ceramic substrates, Metal substrates |
| Line Width/Space | ≥ 0.1mm (Relatively loose) | ≤ 0.075mm, or even micron-level (e.g., HDI boards) |
| Interconnect Tech | Simple through-hole | High-Density Interconnect (HDI), Stacked Microvias |
Advanced PCB Assembly Equipment
Using modern equipment to help you have faster assembly times, higher accuracy and lower costs
Certifications & Quality Assurance
We comply with internationally recognized standards to ensure consistent quality, reliability, and regulatory compliance across all our PCB and assembly services.
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ISO 9001:2015
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ISO 13485:2016
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AS9100D
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REACH
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RoHS
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UL
Frequently Asked Questions
Get Expert Answers. Get Your Project Moving Faster
What services do you offer?
We provide a full range of electronics manufacturing services, including PCB fabrication, PCB assembly (SMT, THT, and mixed), component sourcing, functional testing, IC programming, and full product assembly.
Do you support design assistance?
Yes. Our engineering team provides DFM (Design for Manufacturability) and DFA support to optimize your design for production efficiency and cost.
What file formats do you accept for PCB manufacturing?
We accept standard formats such as Gerber files, ODB++, IPC-2581, and BOM (Bill of Materials) for assembly projects.
Can you support component sourcing?
Yes. We offer reliable component sourcing through authorized distributors and long-term supply chain partners to ensure quality and availability.
How do you ensure product quality?
We implement strict quality control processes, including AOI, X-ray inspection, ICT, and functional testing, along with compliance to international standards.
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